Copper alloy

ABSTRACT

A copper alloy, which contains: a precipitate X composed of Ni and Si; and a precipitate Y that comprises Ni or Si or neither Ni nor Si, wherein the precipitate X has a grain size of 0.001 to 0.1 μm, and the precipitate Y has a grain size of 0.01 to 1 μm.

TECHNICAL FIELD

The present invention relates to an improved copper alloy on itsproperties.

BACKGROUND ART

Heretofore, generally, in addition to iron-based materials, copper-basedmaterials such as phosphor bronze, red brass, and brass, which areexcellent in electrical conductivity and thermal conductivity, have beenused widely as materials for parts of electric and electronic machineryand tools (electrical and electronic instruments).

Recently, demands for miniaturization, weight saving, and associatedhigh-density packaging of parts of electric and electronic machinery andtools have increased, and various characteristics are required for thecopper-based materials applied thereto. Examples of basiccharacteristics required include mechanical properties, electricalconductivity, stress relaxation resistance, and bending property. Ofthose, improvements in tensile strength and bending property arestrongly required, for satisfying the recent demands for theminiaturization of parts or components for the products described above.

The requirements depend on shapes or the like of the parts, and specificrequirements include: a tensile strength of 720 MPa or more and abending property of R/t≦1 (in which R represents a bending radius, and trepresents a thickness); a tensile strength of 800 MPa or more and abending property of R/t<1.5; or a tensile strength of 900 MPa or moreand a bending property of R/t<2. The required characteristics havereached a level that cannot be satisfied with conventional commerciallyavailable, mass-produced alloys such as phosphor bronze, red brass, andbrass. Such alloys each have an increased strength by: allowing Sn or Znhaving a very different atomic radius from that of copper as a matrixphase, to be contained as a solid solution in Cu; and subjecting theresultant alloy having the solid solution to cold working such asrolling or drawing. The method can provide high-strength materials, byemploying a large cold working ratio, but employment of a large coldworking ratio (generally 50% or more) is known to conspicuously degradebending property of the resultant alloy material. The method generallyinvolves a combination of solid solution strengthening and workingstrengthening.

An alternative strengthening method is a precipitation strengtheningmethod that involves formation of a precipitate of a nanometer order inthe materials. The precipitation strengthening method has merits ofincreasing strength and improving electrical conductivity at the sametime, and is used for many alloys.

Of those, a strengthened alloy prepared by forming a precipitatecomposed of Ni and Si by adding Ni and Si into Cu, so-called a Corsonalloy, has a remarkably high strengthening ability compared with manyother precipitation-type alloys (precipitation hardened alloys). Thisstrengthening method is also used for some commercially available alloys(e.g. CDA70250, a registered alloy of Copper Development Association(CDA)). When the alloy generally subjected to precipitatingstrengthening is used for terminal/connector materials, the alloy isproduced through a production process incorporating the following twoimportant heat treatments. A first heat treatment involves heattreatment at a high temperature (generally 700° C. or higher) near amelting point, so-called solution treatment, to allow Ni and Siprecipitated through casting or hot rolling to be contained as a solidsolution into a Cu matrix. A second heat treatment involves heattreatment at a lower temperature than that of the solution treatment,so-called aging treatment, to precipitate Ni and Si, which are in thesolid solution caused at the high temperature, as a precipitate. Thestrengthening method utilizes a difference in concentrations of Ni andSi entering Cu as a solid solution at high temperatures and lowtemperatures, and the method itself is a well-known technique inproduction of precipitation-type alloys.

An example of the Corson alloy suitable for parts of electric andelectronic machinery and tools includes an alloy having a definedcrystal grain size.

However, the precipitation-type alloy has such problems that the crystalgrain size increases to cause too large crystal grains during thesolution treatment, and that the crystal grain size during the solutiontreatment remains unchanged and becomes the crystal grain size of aproduct since the aging treatment generally does not involverecrystallization. An increased amount of Ni or Si to be added requiresa solution treatment at a higher temperature, and it results in that thecrystal grain size tends to increase to cause too large crystal grains,through a heat treatment in a short period of time. Too large crystalgrains occurred in this way cause problems of conspicuous deteriorationin bending property.

Alternatively, a method of improving the bending property of a copperalloy involves addition of Mn, Ni, and P for a mutual reaction toprecipitate a compound, without use of a Ni—Si precipitate.

However, the alloy has a tensile strength of about 640 MPa at most,which is not sufficient for satisfying the recent demands for highstrength through miniaturization of parts. Addition of Si to the copperalloy decreases the amount of the Ni—P precipitate, to thereby reducethe mechanical strength and electrical conductivity. Further, excess Siand P cause problems of occurrence of crack during hot working.

The bending property is hardly maintained with increasing tensilestrength, and a copper alloy having tensile strength, bending property,and electrical conductivity at high levels has been required.

Other and further features and advantages of the invention will appearmore fully from the following description.

DISCLOSURE OF INVENTION

According to the present invention, there is provided the followingmeans:

-   (1) A copper alloy, comprising:    -   a precipitate X composed of Ni and Si; and    -   a precipitate Y that comprises Ni or Si or neither Ni nor Si,        wherein the precipitate X has a grain size of 0.001 to 0.1 μm,        and the precipitate Y has a grain size of 0.01 to 1 μm.-   (2) The copper alloy according to the above item (1), wherein the    precipitate Y has a melting point higher than a solution treatment    temperature.-   (3) The copper alloy according to the above item (1) or (2), which    comprises Ni 2 to 5 mass %, Si 0.3 to 1.5 mass %, and B 0.005 to 0.1    mass %, with the balance being Cu and unavoidable impurities,    wherein the number of grains of the precipitate X per mm² is 20 to    2,000 times the number of grains of the precipitate Y per mm².-   (4) The copper alloy according to the above item (1) or (2), which    comprises Ni 2 to 5 mass %, Si 0.3 to 1.5 mass %, Mn 0.01 to 0.5    mass %, and P 0.01 to 0.5 mass %, with the balance being Cu and    unavoidable impurities, wherein the number of grains of the    precipitate X per mm² is 20 to 2,000 times the number of grains of    the precipitate Y per mm².-   (5) The copper alloy according to the above item (1) or (2), which    comprises Ni 2 to 5 mass %, Si 0.3 to 1.5 mass %, B 0.005 to 0.1    mass %, Mn 0.01 to 0.5 mass %, and P 0.01 to 0.5 mass %, with the    balance being Cu and unavoidable impurities, wherein the number of    grains of the precipitate X per mm² is 20 to 2,000 times the number    of grains of the precipitate Y per mm².-   (6) The copper alloy according to the above item (1) or (2), wherein    the number of grains of the precipitate X is 10⁸ to 10¹² per mm²,    and the number of grains of the precipitate Y is 10⁴ to 10⁸ per mm².-   (7) The copper alloy according to any one of the above items (1) to    (6), which comprises at least one element selected from the group    consisting of Al, As, Hf, Zr, Cr, Ti, C, Fe, P, In, Sb, Mn, Ta, and    V in an amount of 0.005 to 0.5 mass %.-   (8) The copper alloy according to the above item (6) or (7), wherein    the precipitate Y is composed of at least one of Al—As, Al—Hf,    Al—Zr, Al—Cr, Ti—C, Cu—Ti, Cu—Zr, Cr—Si, Fe—P, Fe—Si, Fe—Zr, In—Ni,    Mg—Sb, Mn—Si, Ni—Sb, Si—Ta, and V—Zr.-   (9) The copper alloy according to any one of the above items (3) to    (8), which further comprises at least one element selected from the    group consisting of Sn 0.1 to 1.0 mass %, Zn 0.1 to 1.0 mass %, and    Mg 0.05 to 0.5 mass %.-   (10) The copper alloy according to any one of the above items (1) to    (9), which is for use in an electric or electronic machinery and    tool.

BEST MODE FOR CARRYING OUT THE INVENTION

The present invention is explained in detail below.

The inventors of the present invention have conducted intensive studieson a copper alloy suitably used for electrical and electronic parts, andwe have found a relationship among grain sizes of Ni—Si precipitate andother precipitate(s) in a copper alloy structure, a ratio indistribution density thereof, and suppression of growth of too largecrystal grains. As a result, the inventors of the present invention havecompleted the present invention of the copper alloy having excellenttensile strength and favorable bending property.

Preferable embodiments of the copper alloy of the present invention willbe described in detail.

The present invention relates to controlling of a crystal grain size ofan alloy. To be specific, the inventors of the present invention haveconducted experiments for a method of controlling a grain size, from twostandpoints, and we have attained a specific alloy structure of thepresent invention, as well as a preferable composition thereof.

First, the inventors of the present invention have searched for anelement that does not allow a crystal grain size to increase during asolution treatment. The inventors of the present invention have foundthat a precipitate composed of Ni and B does not form any solid solutionin a Cu matrix phase even at high temperatures of the solutiontreatment, and that the precipitate exists in crystal grains of the Cumatrix phase and the precipitate grains, to exhibit an action and effectof suppressing growth of the crystal grains of the matrix. The actionand effect is also confirmed for Al—As, Al—Hf, Al—Zr, Al—Cr, Ti—C,Cu—Ti, Cu—Zr, Cr—Si, Fe—P, Fe—Si, Fe—Zr, In—Ni, Mg—Sb, Mn—Si, Ni—Sb,Si—Ta, and V—Zr, which have been also tested.

Second, the inventors of the present invention have searched for anelement that serves as a nucleus at initial recrystallization during thesolution treatment. The inventors of the present invention have foundthat an intermetallic compound which is a precipitate composed of Mn andP serves as a nucleation site for recrystallization at a solutiontreatment temperature, and that more crystal grains are formed(nucleation) than that in the case where the precipitate composed of Mnand P is not added. Formation of more crystal grains causes mutualinterference of the crystal grains during grain growth, to therebysuppress the grain growth. Such an action and effect of the nucleationsite for recrystallization is also confirmed for Al—As, Al—Hf, Al—Zr,Al—Cr, Ti—C, Cu—Ti, Cu—Zr, Cr—Si, Fe—P, Fe—Si, Fe—Zr, In—Ni, Mg—Sb,Mn—Si, Ni—Sb, Si—Ta, and V—Zr.

Further, a remarkable effect is confirmed in simultaneous precipitationof Mn—P and Ni—B, which effect cannot be obtained by mere addition ofthose in the cases using only one of Mn—P or Ni—B.

It is important that the aforementioned precipitate do not form anysolid solution in the Cu matrix even during the solution treatment. Thatis, the precipitate must have a melting point higher than the solutiontreatment temperature. The precipitate is not limited to theaforementioned precipitates as long as it has a melting point higherthan the solution treatment temperature, and the present inventionincludes any precipitate(s) other than the aforementioned precipitates.In the present invention, a precipitate having a melting point higherthan the solution treatment temperature provides an effect of preventinggrowth of too large crystal grains during the solution treatment orforming many crystal grains (nucleation) by serving as a nucleation sitefor recrystallization.

The copper alloy of the present invention is an inexpensive,high-performance copper alloy having excellent bending property andother favorable characteristics, and it is preferable for a variety ofelectric and electronic machinery and tools including electronic parts,e.g. vehicle terminals/connectors, relays, and switches.

Next, the action and effect of each alloy element and a preferable rangeof addition amount of the alloy element will be described.

Ni and Si are elements that can be added in a controlled addition ratioof Ni to Si for forming a Ni—Si precipitate for precipitationstrengthening, to thereby enhance the mechanical strength of the copperalloy. The amount of Ni to be added is generally 2 to 5 mass %,preferably 2.1 to 4.6 mass %. The Ni amount is more preferably 3.5 to4.6 mass %, for satisfying a tensile strength of 800 MPa or more and abending property of R/t<1.5, or a tensile strength of 900 MPa or moreand a bending property of R/t<2. A too small Ni amount provides a smallprecipitated and hardened amount that results in insufficient mechanicalstrength, and a too large Ni amount results in a conspicuously lowelectrical conductivity.

Further, Si is known to provide the largest strengthening effect atabout ¼ the Ni addition amount calculated in terms of mass %, and suchan amount is preferable. A too much Si addition amount is apt to causecracking of an ingot during hot working, and thus, taking that intoconsideration, an upper limit of the Si addition amount is to bedetermined. The Si addition amount is generally 0.3 to 1.5 mass %,preferably 0.5 to 1.1 mass %, more preferably 0.8 to 1.1 mass %.

B forms a precipitate with Ni added. The effect of B as described aboveis that B is an element for suppressing increase of the crystal grainsize to become too large (giant) during the solution treatment, but Btakes no part in the precipitation strengthening. From the experiments,the present inventors confirmed that generally B 0.005 to 0.1 mass %,preferably B 0.01 to 0.07 mass % is required for exhibiting the effect.A too large B addition amount results in too large crystallized productduring casting to cause problems in ingot quality, and a too small Baddition amount provides no addition effect.

A precipitate of Mn and P provides an effect of forming a nucleationsite for crystal grains during the solution treatment, but theprecipitate takes no part in the precipitation strengthening. The effectis confirmed for a material containing generally 0.01 mass % or more and0.5 mass % or less, preferably 0.02 to 0.3 mass % each of Mn and Padded. A material containing Mn and P each in a too small amountexhibits no effect. Further, when an addition amount of each of Mn and Pis too large, it causes problems of crack occurrence during hot workingto inhibit working into a thin plate or sheet.

Other examples of the precipitate that provides an effect of suppressingincrease of the crystal grain size to become too large, or forming anucleation site for the crystal grains, in the solution treatment,include Al—As, Al—Hf, Al—Zr, Al—Cr, Ti—C, Cu—Ti, Cu—Zr, Cr—Si, Fe—P,Fe—Si, Fe—Zr, In—Ni, Mg—Sb, Mn—Si, Ni—Sb, Si—Ta, and V—Zr. The copperalloy preferably contains at least one element selected from the groupconsisting of Al, Zr, Cr, C, Ti, Fe, In, As, Hf, Sb, Ta, and V in anamount of each generally 0.005 to 0.5 mass %, preferably 0.01 to 0.4mass % for exhibiting the aforementioned effect. If the addition amountof these elements is too large, the resultant alloy forms a too largecrystallized product during casting to cause a problem in quality of theresultant ingot, and if the addition amount is too small, no additioneffect is provided.

Further, Zn, Sn, and Mg are preferably added to further improve thecharacteristics.

Zn is added preferably in an amount of 0.1 to 1.0 mass %. Zn is anelement which forms a solid solution in a matrix, but Zn additionsignificantly alleviates solder embrittlement. The preferable primaryuses of the alloy of the present invention are electric and electronicmachinery and tools and electronic part materials such as vehicleterminals/connectors, relays, and switches. Most of them are joined bysolder, and thus the alleviation of solder embrittlement is an importantelemental technique.

Further, Zn addition may lower the melting point of the alloy, tocontrol the states of formation of the precipitate composed of Ni and Band the precipitate composed of Mn and P. Both the precipitates areformed during solidification. Thus, a high solidification temperature ofthe alloy increases the grain size, to provide a small contribution ofthe precipitates to the effects of suppressing increase of the crystalgrain size and forming a nucleation site for the crystal grains. Thelower limit of Zn addition is defined as 0.1 mass %, because it is aminimum amount that provides alleviations in solder embrittlement. Theupper limit of Zn addition is defined as 1.0 mass %, because a Znaddition amount more than 1.0 mass % may degrade the electricalconductivity.

Sn and Mg are also preferable elements for their uses. Sn and Mgaddition provides an effect of improving creep resistance, which isemphasized in electronic machinery and tool terminals/connectors. Theeffect is also referred to as stress relaxing resistance, and it is animportant elemental technique that assumes reliability of theterminals/connectors. Separate addition of Sn or Mg may improve thecreep resistance, but Sn and Mg are elements that can further improvethe creep resistance by a synergetic effect.

The lower limit of Sn addition is defined as 0.1 mass %, because it is aminimum amount that provides improvements in creep resistance. The upperlimit of Sn addition is defined as 1 mass %, because an Sn additionamount more than 1 mass % may degrade the electrical conductivity.

The lower limit of Mg addition is defined as 0.05 mass %, because a toosmall Mg addition amount provides no effect of improving the creepresistance. The upper limit of Mg addition is defined as 0.5 mass %,because an Mg addition amount of more than 0.5 mass % not only saturatesthe effect but also may degrade hot-workability.

Sn and Mg have a function of accelerating formation of a precipitatecomposed of Ni and Si. It is important to add preferable amounts of Snand Mg, serving as fine nucleation sites for the precipitate.

Next, an alloy structure of the copper alloy of the present inventionwill be described.

The precipitate X, which is an intermetallic compound composed of Ni andSi, has a grain size of 0.001 to 0.1 μm, preferably 0.003 to 0.05 μm,more preferably 0.005 to 0.02 μm. A too small grain size provides nostrength enhancement; and a too large grain size, which is agenerally-called over-aging state, results in no enhancement inmechanical strength and a poor bending property.

Herein (in the present specification, including the claims), aprecipitate(s) other than the precipitate of the intermetallic compoundcomposed of Ni and Si, is referred to as the precipitate Y. Theprecipitate Y has an effect of refining the crystal grains, throughinteraction with the Ni—Si precipitate X. The effect is remarkable inthe presence of the precipitate X. The precipitate Y has a grain size ofpreferably 0.01 to 1 μm, more preferably 0.05 to 0.5 μm, most preferably0.05 to 0.13 μm. A too small grain size provides no effect ofsuppressing the grain growth and increasing the numbers of nucleationsites, and a too large grain size degrades the bending property.

Next, the numbers of precipitates X and Y will be described. The numberof grains of the precipitate X is preferably 20 to 2,000 times thenumber of grains of the precipitate Y. This is because the bendingproperty is particularly excellent within the aforementioned range. Whenthe number of grains of the precipitate X is too small, it may notprovide a targeted mechanical strength, and when the number thereof istoo large, it may degrade the bending property. The number of grains ofthe precipitate X is more preferably 100 to 1,500 times the number ofgrains of the precipitate Y Herein, the number of grains of aprecipitate means an average value per unit volume.

When the precipitate Y is an intermetallic compound that is one otherthan Ni—Si and is selected from the group consisting of Al—As, Al—Hf,Al—Zr, Al—Cr, Ti—C, Cu—Ti, Cu—Zr, Cr—Si, Fe—P, Fe—Si, Fe—Zr, In—Ni,Mg—Sb, Mn—Si, Ni—Sb, Si—Ta, and V—Zr, the number of grains of theprecipitate X is preferably 10⁸ to 10¹² per mm², and the number ofgrains of the precipitate Y is preferably 10⁴ to 10⁸ per mm². This isbecause the aforementioned ranges provide particularly excellent bendingproperty. If the number of precipitates is too small, the resultantalloy may not have a targeted mechanical strength. On the other hand, ifthe number of precipitates is too large, the resultant alloy may be poorin bending property. The number of grains of the precipitate X is morepreferably 5×10⁹ to 6×10¹¹ per mm², and the number of grains of theprecipitate Y is more preferably 10⁴ to 4×10⁷ per mm².

The effects of X and Y are more remarkable with the increased amounts ofNi and Si. The above specific X and Y as defined in the presentinvention, have realized, for the first time, a tensile strength of 800MPa or more and a bending property of R/t<1.5, or a tensile strength of900 MPa or more and a bending property of R/t<2, which are hithertounattained properties.

The precipitates as referred to in the present invention include, forexample, intermetallic compounds, carbides, oxides, sulfides, nitrides,compounds (solid solution), and elementary metals.

The copper alloy of the present invention has a crystal grain size ofgenerally 20 μm or less, preferably 10.0 μm or less. A too large crystalgrain size may not provide a tensile strength of 720 MPa or more and abending property of R/t<2. The copper alloy has a crystal grain size ofmore preferably 8.5 μm or less. There is no particular restriction onthe lower limit of the crystal grain size, but the copper alloy has acrystal grain size of generally 0.5 μm or more.

An example of a production method for the copper alloy of the presentinvention involves: melting a copper alloy having the aforementionedpreferable element composition; casting into an ingot; and hot rollingthe ingot by heating the ingot at a temperature rising rate of 20 to200° C./hr, hot rolling the ingot at 850 to 1,050° C. for 0.5 to 5hours, and quenching the ingot to a finished temperature of 300 to 700°C. after the hot rolling. In this way, the precipitates X and Y areformed. After hot rolling, for example, the resultant alloy is formedinto a given thickness, through a combination of a solution treatment,annealing, and cold rolling.

The solution treatment is a heat treatment for allowing Ni and Siprecipitated during casting or hot rolling to form a solid solutionagain and to recrystallize at the same time. The temperature of thesolution treatment may be adjusted according to an Ni addition amount.For example, the solution treatment temperature is preferably 650° C.for an Ni amount of 2.0 mass % or more but less than 2.5 mass %, 800° C.for an Ni amount of 2.5 mass % or more but less than 3.0 mass %, 850° C.for an Ni amount of 3.0 mass % or more but less than 3.5 mass %, 900° C.for an Ni amount of 3.5 mass % or more but less than 4.0 mass %, 950° C.for an Ni amount of 4.0 mass % or more but less than 4.5 mass %, and980° C. for an Ni amount of from 4.5 mass % to 5.0 mass %.

For example, the heat treatment at 850° C. of a material containing Ni3.0 mass % allows sufficiently precipitated Ni and Si, to form again thesolid solution and provide crystal grains of 10 μm or less. However, theheat treatment at the same temperature of an alloy having a Ni amountsmaller than 3.0 mass % causes growth of crystal grains into too largegrains each having a grain size of not less than 10 μm. Further, a toolarge Ni amount may not provide an ideal solution state, and themechanical strength may not be enhanced through the subsequent agingtreatment.

The present invention apparently provides improvement in bendingproperty, in particular, of a high strength copper alloy having atensile strength of 800 MPa or more. Further, the present inventionprovides similar improvement in bending property of a copper alloyhaving a tensile strength of less than 800 MPa.

The copper alloy of the present invention is excellent in bendingproperty and has an excellently high tensile strength, and it ispreferable for lead frame, connector, and terminal materials forelectric and electronic machinery and tools, in particular, forconnector or terminal materials, relays, and switches, which may be usedin automobiles.

According to the present invention, can be provided a copper alloyhaving better bending property than that of conventional alloys with thesame level of tensile strength, which is particularly preferable forelectric and electronic machinery and tools, through satisfactory attainboth of a quite high tensile strength and an excellent bending property(R/t), by adding B, Mn, P, Al, Zr, Cr, C, Ti, Fe, In, As, Hf, Sb, Ta, V,or the like for controlling crystal grain sizes of a Cu—Ni—Si alloy andan alloy further containing Sn, Zn, and Mg in addition of the abovealloy elements.

EXAMPLES

The present invention will be described in more detail based on examplesgiven below, but the invention is not meant to be limited by these.

Example 1

An alloy containing Ni 4.2 mass %, Si 1.0 mass %, and Cr in thefollowing amount, with the balance being Cu and unavoidable impurities,was melted in a high-frequency melting furnace. The amounts of Cr to beadded in the copper alloys were 0.05 mass % in Example 1, 0.15 mass % inExample 2, 0.25 mass % in Example 3, 0.5 mass % in Example 4, 0.7 mass %in Example 5, 0.9 mass % in Example 6, 0.005 mass % in ComparativeExamples 1, 0.2 mass % in Comparative Examples 2, 0.5 mass % inComparative Examples 3, and 0.8 mass % in Comparative Examples 4,respectively. The resultant was cast at a cooling rate of 10 to 30°C./sec, to thereby obtain an ingot of thickness 30 mm, width 100 mm, andlength 150 mm. The ingot was maintained at 900° C. for 1 hour, and wasthen subjected to hot rolling, to produce a hot rolled sheet having athickness t of 12 mm. The sheet was subjected to chamfering in athickness of 1 mm on both sides to a thickness t of 10 mm, and it wasthen finished into a thickness of t=0.167 mm through cold rolling. Thesheet material was subjected to a solution treatment at 950° C. for 20sec.

Immediately after the solution treatment, the sheet material wassubjected to water quenching. Then, the alloys each were subjected to anaging treatment at 450 to 500° C. for 2 hours and cold rolling at aworking ratio of 10%, to thereby obtain a sample of t=0.15 mm.

The following characteristics of the thus-obtained samples were testedand evaluated as mentioned in below.

a. Electrical Conductivity

Electrical conductivity was calculated by measuring a specificresistance of the sample through a four terminal method in athermostatic bath maintained at 20° C. (±0.5° C.). The distance betweenthe terminals was set to 100 mm.

b. Tensile Strength

Tensile strengths of 3 test pieces prepared according to JIS Z 2201-13Bcut out from the sample in a direction parallel to the rollingdirection, were measured according to JIS Z 2241, and an average valuethereof was obtained.

c. Bending Property

A test piece was cut out from the sample in a direction parallel to therolling direction into a size of width 10 mm and length 25 mm. Theresultant test piece was W-bent at 90° at a bending radius R that wouldbe 0, 0.1, 0.15, 0.2, 0.25, 0.3, 0.4, 0.5, or 0.6 (mm), with a bendingaxis being perpendicular to the rolling direction. Whether cracks wasoccurred or not at the bent portion, was observed with the naked eyethrough observation with an optical microscope of 50 timesmagnification, and the bent sites were observed with a scanning electronmicroscope to examine whether cracks were observed or not. Evaluationresults are designated by R/t (in which R represents a bending radius,and t represents a sheet thickness), and the R/t was calculated byemploying a (limit) maximum R at which crack was occurred. If no cracksare formed at R=0.15 and cracks are formed at R=0.1, since the samplehad a thickness (t)=0.15 mm, R/t=0.15/0.15=1 is obtained, which is shownin the following table.

d. Grain Size and Distribution Density of Precipitate

The sample was punched out into a shape of a disc of diameter 3 mm, andthe resultant was subjected to thin-film-polishing by using a twinjetpolishing method. Photographs (5,000 and 100,000 times magnification) ofthe resultant sample were taken at 3 arbitrary positions with atransmission electron microscope at an accelerating voltage of 300 kV,and the grain size and the density of the precipitate were measured onthe photographs. Measurement of the grain size and the density of theprecipitate were carried out in the following manner: setting anincident electron beam azimuth to [001], and measuring the number offine grains of the precipitate X composed of Ni—Si in a high-powerphotograph (100,000 times magnification) at n=100 (n represents thenumber of viewing fields for observation), since the precipitate X wasfine; and, on the other hand, measuring the number of grains of theprecipitate Y in a low-power photograph (5,000 times magnification) atn=10; thereby to eliminate the localized bias on the numbers. Thenumbers were calculated into numbers per unit area (/mm²).

As is apparent from the results shown in Table 1, the copper alloys ofExamples according to the present invention each had excellentcharacteristics in both the mechanical strength and the bendingproperty. However, contrary to the above, the copper alloys ofComparative Examples 1 and 3 each had a grain size of the precipitate Xthat did not fall in the range defined in the present invention, and thecopper alloys of Comparative Example 2 and 4 each had a grain size ofthe precipitate Y that did not fall in the range defined in the presentinvention. Thus, the copper alloys of these Comparative Examples eachwere conspicuously poor in bending property being R/t≧2, even they eachhad substantially the same mechanical strength as those of Examples.TABLE 1 (Number of Grain size Grain size grains of X)/ Tensile Bendingof X of Y (number of strength property μm μm grains of Y) MPa R/tExample 1 0.003 0.03 100 911 1.67 Example 2 0.03 0.05 320 921 1.67Example 3 0.08 0.09 210 908 1.67 Example 4 0.02 0.08 530 903 1.67Example 5 0.07 0.02 360 921 1.67 Example 6 0.04 0.03 830 918 1.67Comparative 0.0003 0.05 780 912 2 example 1 Comparative 0.04 0.003 150925 2 example 2 Comparative 0.5 0.03 950 923 2.67 example 3 Comparative0.06 1.2 740 915 3.3 example 4

Example 2

The copper alloys each having the composition, as shown in Table 2, withthe balance being Cu and unavoidable impurities, were tested andevaluated in the same manner as in Example 1. The production method andthe measurement method were the same as those in Example 1.

As is apparent from the results shown in Table 2, the copper alloys ofExamples according to the present invention each had excellentcharacteristics in both the mechanical strength and the bendingproperty. However, on the contrary, the copper alloy of ComparativeExample 5 had the Ni amount smaller than the preferable lower limit ofthe range in the present invention, and thus failed to give the targetedtensile strength. The copper alloy of Comparative Example 6 had a largeNi amount, and occurred cracks during working, and thus failed toproduce a material for evaluation. The copper alloys of ComparativeExamples 7 and 8 each had a B amount and a ratio of the numbers of Xs toYs that did not fall in the respective ranges defined in the presentinvention, and thus failed to give the targeted mechanical strength andthe bending property in combination. TABLE 2 (Number of grains ofElements Grain Grain X)/(number Tensile Bending Electrical Ni Si B Othersize of X size of Y of grains of strength property conductivity mass %mass % mass % mass % μm μm Y) MPa R/t % IACS Example 7 2.20 0.50 0.050 —0.002 0.13 150 721 1 42.0 Example 8 2.70 0.64 0.060 — 0.002 0.05 350 7721 41.0 Example 9 3.30 0.79 0.040 — 0.002 0.5 330 813 1.5 39.0 Example 103.80 0.90 0.050 — 0.003 0.18 500 861 1.5 37.0 Example 11 4.20 1.00 0.040— 0.002 0.7 450 903 1.5 35.5 Example 12 3.80 0.90 0.009 — 0.002 0.3 1050844 1.5 37.0 Example 13 3.80 0.90 0.085 — 0.003 0.05 320 838 1.5 37.0Example 14 4.20 1.00 0.008 — 0.002 0.24 1400 913 1.67 35.5 Example 154.20 1.00 0.094 — 0.002 0.8 630 909 1.67 35.5 Example 16 2.25 0.51 0.030Zn 0.15 0.002 0.11 150 721 1 41.0 Example 17 3.35 0.82 0.050 Sn 0.120.002 0.23 340 811 1.5 38.0 Mg 0.07 Example 18 4.05 0.98 0.065 Zn 0.950.002 0.28 550 902 1.67 36.2 Sn 0.80 Mg 0.40 Comparative 1.50 0.25 0.050— 0.002 0.1 450 600 1 45.0 example 5 Comparative 6.50 1.50 0.060 — Nosample was made example 6 Comparative 3.80 0.90 0.001 — 0.0020.003 >2000 866 2 37.0 example 7 Comparative 3.80 0.90 0.500 — 0.001 1.210 780 2.67 37.0 example 8Note;“—” not added

Example 3

The copper alloys each having the composition, as shown in Table 3, withthe balance being Cu and unavoidable impurities, were tested andevaluated in the same manner as in Example 1. The production method andthe measurement method were the same as those in Example 1.

As is apparent from the results shown in Table 3, the copper alloys ofExamples according to the present invention each had excellentcharacteristics in both the mechanical strength and the bendingproperty. However, on the contrary, the copper alloy of ComparativeExample 9 had the Ni and Si amounts smaller than the preferable lowerlimits of the respective ranges in the present invention, and thusfailed to give the targeted tensile strength. The copper alloy ofComparative Example 10 had large Ni and Si amounts, and occurred cracksduring working, and thus failed to produce a material for evaluation.The copper alloys of Comparative Examples 11 to 14 each had a Mn amountand/or a P amount that did not fall in the ranges defined in the presentinvention, and/or a ratio of the numbers of grains of X to that of Ythat did not fall in the range defined in the present invention. Thus,the copper alloys of these Comparative examples each were poor inbending property being R/t of 2 or more. TABLE 3 (Number of grains ofElements Grain Grain X)/(number Tensile Bending Electrical Ni Si Mn POther size of X size of Y of grains of strength property conductivitymass % mass % mass % mass % mass % μm μm Y) MPa R/t % IACS Example 192.20 0.50 0.100 0.100 — 0.002 0.08 450 728 1 42.0 Example 20 2.70 0.640.120 0.090 — 0.002 0.1 480 758 1.5 41.0 Example 21 3.30 0.79 0.0800.110 — 0.003 0.5 1020 811 1.5 39.0 Example 22 3.80 0.90 0.110 0.120 —0.002 0.12 140 883 1.5 37.0 Example 23 4.20 1.00 0.090 0.100 — 0.0020.44 90 921 1.67 35.5 Example 24 3.80 0.90 0.020 0.030 — 0.002 0.13 420873 1.5 37.0 Example 25 3.80 0.90 0.450 0.230 — 0.003 0.07 1080 833 1.537.0 Example 26 4.20 1.00 0.030 0.040 — 0.003 0.08 80 918 1.67 35.5Example 27 4.20 1.00 0.310 0.390 — 0.002 0.18 950 928 1.67 35.5 Example28 2.21 0.53 0.030 0.025 Mg 0.20 0.002 0.11 122 720 1 41.5 Example 293.32 0.86 0.050 0.022 Zn 0.15 0.002 0.23 345 808 1.5 38.2 Sn 0.30Example 30 4.06 0.99 0.082 0.040 Zn 0.90 0.002 0.28 454 900 1.67 36.9 Sn0.50 Mg 0.45 Comparative 1.50 0.25 0.120 0.090 — 0.002 0.12 620 662 145.0 example 9 Comparative 6.50 1.50 0.110 0.120 — No sample was madeexample 10 Comparative 3.80 0.90 0.003 0.090 — 0.003 0.03 10 913 2 37.0example 11 Comparative 3.80 0.90 0.110 0.005 — 0.003 0.31 13 921 2 37.0example 12 Comparative 3.80 0.90 0.670 0.090 — 0.002 0.06 14 908 2.6737.0 example 13 Comparative 3.80 0.90 0.130 0.730 — 0.002 0.13 12 9032.67 37.0 example 14Note;“—” not added

Example 4

The copper alloys each containing Ni 4.2 mass %, Si 1.0 mass %, and theelements as shown in Table 4, with the balance being Cu and unavoidableimpurities, were tested and evaluated in the same manner as inExample 1. The production method and the measurement method were thesame as those in Example 1.

As is apparent from the results shown in Table 4, the copper alloys ofExamples according to the present invention each had a tensile strengthof 900 MPa or more and R/t<2. However, on the contrary, the copper alloyof Comparative Example 15 had a B amount and a ratio of the numbers ofgrains of X to that of Y that did not fall in the ranges defined in thepresent invention. The copper alloy of Comparative Example 16 had an Mnamount and a grain size of the precipitate Y that did not fall in theranges defined in the present invention. The copper alloy of ComparativeExample 17 had a P amount and a grain size of the precipitate Y that didnot fall in the ranges defined in the present invention. The copperalloy of Comparative Example 18 had an Mn amount and a ratio of thenumbers of grains of X to that of Y that did not fall in the rangesdefined in the present invention. The copper alloy of ComparativeExample 19 had a P amount and a ratio of the numbers of grains of X tothat of Y that did not fall in the ranges defined in the presentinvention. Thus, the copper alloys of these Comparative examples eachwere poor in bending property being R/t of 2 or more. TABLE 4 (Number ofElements Grain Grain grains of Tensile Bending Electrical B Mn P Othersize of X size of Y X)/(number of strength property conductivity mass %mass % mass % mass % μm μm grains of Y) MPa R/t % IACS Example 31 0.0500.100 0.100 — 0.003 0.13 150 904 1.67 35.5 Example 32 0.008 0.120 0.090— 0.002 0.82 780 911 1.67 35.5 Example 33 0.094 0.080 0.110 — 0.003 0.081020 903 1.67 35.5 Example 34 0.050 0.020 0.030 — 0.003 0.09 180 9081.67 35.5 Example 35 0.050 0.450 0.230 — 0.002 0.45 330 921 1.67 35.5Example 36 0.055 0.025 0.025 Sn 0.30 0.003 0.54 234 902 1.67 35.2Example 37 0.015 0.200 0.150 Zn 0.20 0.002 0.67 332 901 1.67 34.2 Mg0.08 Example 38 0.020 0.025 0.025 Zn 0.80 0.003 0.7 441 905 1.67 34.9 Sn0.60 Mg 0.20 Comparative 0.500 0.120 0.090 — 0.002 0.45 11 921 2.67 35.5example 15 Comparative 0.050 0.003 0.090 — 0.003 0.007 400 905 2.67 35.5example 16 Comparative 0.050 0.110 0.005 — 0.003 0.005 580 913 3.3 35.5example 17 Comparative 0.050 0.670 0.090 — 0.002 0.25 5 909 3.3 35.5example 18 Comparative 0.050 0.130 0.730 — 0.002 0.7 8 915 2.67 35.5example 19Note;“—” not added

Example 5

The copper alloys each containing Ni, Si, and Sb, as shown in Table 5,with the balance being Cu and unavoidable impurities, were tested andevaluated in the same manner as in Example 1, and crystal graindiameters thereof were measured. The production method and themeasurement method were the same as those in Example 1. The amounts ofSb to be added in the copper alloys of Comparative Examples 28, 29, 30,and 31 were 0.01 mass %, 1.0 mass %, 0.02 mass %, and 1.2 mass %,respectively. The Sb amounts of the other copper alloys each were 0.1mass %.

The crystal grain size was measured according to JIS H 0501 (sectionmethod). The bending property was evaluated by: as designated “GW”, theaforementioned samples each cut out parallel to the rolling directioninto a size of width 10 mm and length 25 mm, and bent with a bendingaxis perpendicular to the rolling direction; and, as designated “BW”,the samples each cut out parallel to the rolling direction into a sizeof width 25 mm and length 10 mm, bent in the same manner as that in GWbut with a bending axis parallel to the rolling direction, and examinedin the same manner as that in GW through observation of bent portions.

As is apparent from the results shown in Table 5, the copper alloys ofExamples according to the present invention each had excellentcharacteristics. However, contrary to the above, the copper alloy ofComparative Example 20 had a too small Ni amount, and thus it had a lowprecipitation density of the precipitate X, and was poor in tensilecharacteristics. The copper alloy of Comparative Example 21 had a largeNi amount, and thus it suffered severe working cracks, although it wasworked into a final thickness. Accordingly, although the copper alloystructure of the resultant sample in this Comparative Example 21 wasexamined, it was impossible to examine characteristics thereof. Thecopper alloy of Comparative Example 22 had a too small Si amount, andthus it had a low precipitation density of the precipitate X, and waspoor in tensile characteristics. The copper alloy of Comparative Example23 had a too large Si amount, and thus it suffered severe workingcracks, although it was worked into a final thickness. Accordingly,although the copper alloy structure of the resultant sample in thisComparative Example 23 was examined, it was impossible to examinecharacteristics thereof. The copper alloy of Comparative Example 24 hada small grain size of the precipitate X, the copper alloy of ComparativeExample 25 had a large grain size of the precipitate X, and the copperalloy of Comparative Example 26 had a too low precipitation density ofthe precipitate X, and thus these copper alloys each were poor intensile characteristics. The copper alloy of Comparative Example 27 hada large Si amount, and thus had a high precipitation density of theprecipitate X, resulting in brittle cracking. The copper alloy ofComparative Example 27 suffered severe working cracks, although it wasworked into a final thickness. Accordingly, although the copper alloystructure of the resultant sample in this Comparative Example 27 wasexamined, it was impossible to examine characteristics thereof. Thecopper alloy of Comparative Example 28 had a small grain size of theprecipitate Y, the copper alloy of Comparative Example 29 had a largegrain size of the precipitate Y, and the copper alloy of ComparativeExample 30 had a too low precipitation density of the precipitate Y, andthus these copper alloys each had a too large crystal grain size, andwere poor in bending property. The copper alloy of Comparative Example31 had a high precipitation density of the precipitate Y, resulting inbrittle cracking. The copper alloy of Comparative Example 31 sufferedsevere working cracks, although it was worked into a final thickness.Accordingly, although the copper alloy structure of the resultant samplein this Comparative Example 31 was examined, it was impossible toexamine characteristics thereof. TABLE 5 Precipitate X Precipitate YCrystal Bending Bending Elements Grain Grain grain Tensile Electricalproperty property Ni Si size Density/ size Density/ size strengthconductivity GW BW mass % mass % μm mm² μm mm² μm MPa % IACS R/t R/tExample 39 3.8 0.9 0.025 6 × 10¹⁰ 0.210 3 × 10⁵ 8 830 35 1 1 Example 403.5 0.8 0.023 2 × 10¹⁰ 0.220 5 × 10⁵ 10 844 35 1 1 Example 41 4.2 1.20.026 2 × 10¹¹ 0.230 7 × 10⁵ 9 908 32 1.5 1.5 Example 42 2.1 0.5 0.028 3× 10⁸  0.320 4 × 10⁵ 8 710 39 1 1 Comparative 1.8 0.5 0.024 7 × 10⁷ 0.300 3 × 10⁵ 11 610 45 1 1 example 20 Comparative 5.5 1.3 0.029 8 ×10¹¹ 0.280 5 × 10⁵ 9 Not measurable due to working cracks example 21Comparative 2 0.25 0.022 3 × 10⁷  0.240 4 × 10⁵ 10 704 39 1 1 example 22Comparative 5.2 1.9 0.029 9 × 10¹¹ 0.310 7 × 10⁵ 12 Not measurable dueto working cracks example 23 Comparative 3.5 0.8 0.0001 5 × 10¹⁰ 0.330 9× 10⁵ 10 755 30 1 1 example 24 Comparative 3.6 0.8 0.112 6 × 10¹⁰ 0.2907 × 10⁵ 9 789 37 1 1 example 25 Comparative 3 0.7 0.030 5 × 10⁶  0.300 8× 10⁵ 8 739 33 1 1 example 26 Comparative 4.8 1.55 0.028 4 × 10¹³ 0.2803 × 10⁵ 10 Not measurable due to working cracks example 27 Comparative3.9 0.8 0.033 5 × 10¹⁰ 0.008 7 × 10⁵ 40 829 35 3 4 example 28Comparative 3.4 0.6 0.031 6 × 10¹⁰ 1.260 2 × 10⁵ 66 822 38 3 3 example29 Comparative 3.6 0.7 0.029 3 × 10¹⁰ 0.330 7 × 10³ 26 840 35 2 2example 30 Comparative 3.5 0.6 0.032 5 × 10¹⁰ 0.230 8 × 10⁹ 6 Notmeasurable due to working cracks example 31

Example 6

The copper alloys each containing Ni, Si, and Cr, as shown in Table 6and below, with the balance being Cu and unavoidable impurities, weretested and evaluated in the same manner as that in Example 5. Theproduction method and the measurement method were the same as those inExample 5. The Cr amounts of the copper alloys of Comparative Examples40, 41, 42, and 43 were 0.005 mass %, 0.8 mass %, 0.01 mass %, and 1.0mass %, respectively. Each of the Cr amounts of the other copper alloyswas 0.05 mass %.

As is apparent from the results shown in Table 6, the copper alloys ofExamples according to the present invention each had excellentcharacteristics. However, contrary to the above, the copper alloy ofComparative Example 32 had a too small Ni amount, and thus had a lowprecipitation density of the precipitate X, and it was poor in tensilecharacteristics. The copper alloy of Comparative Example 33 had large Niand Si amounts, and thus suffered severe working cracks, although it wasworked into a final thickness. Accordingly, although the copper alloystructure of the resultant sample in this Comparative Example 33 wasexamined, it was impossible to examine characteristics thereof. Thecopper alloy of Comparative Example 34 had a small Si amount, and thushad a low precipitation density of the precipitate X, and it was poor intensile characteristics. The copper alloy of Comparative Example 35 hada large Si amount, and thus suffered severe working cracks, although itwas worked into a final thickness. Accordingly, although the copperalloy structure of the resultant sample in this Comparative Example 35was examined, it was impossible to examine characteristics thereof. Thecopper alloy of Comparative Example 36 had a small grain size of theprecipitate X, the copper alloy of Comparative Example 37 had a largegrain size of the precipitate X, and the copper alloy of ComparativeExample 38 had a too low precipitation density of the precipitate X, andthus these copper alloys for comparison each were poor in tensilecharacteristics. The copper alloy of Comparative Example 39 had a highprecipitation density of the precipitate X, resulting in brittlecracking. The copper alloy of Comparative Example 39 suffered severeworking cracks, although it was worked into a final thickness.Accordingly, although the copper alloy structure of the resultant samplein this Comparative Example 39 was examined, it was impossible toexamine characteristics thereof. The copper alloy of Comparative Example40 had a small grain size of the precipitate Y, the copper alloy ofComparative Example 41 had a large grain size of the precipitate Y, andthe copper alloy of Comparative Example 42 had a too low precipitationdensity of the precipitate Y, and thus these copper alloys forcomparison each had a too large crystal grain size, and were poor inbending property. The copper alloy of Comparative Example 43 had a highprecipitation density of the precipitate Y, resulting in brittlecracking. The copper alloy of Comparative Example 43 suffered severeworking cracks, although it was worked into a final thickness.Accordingly, although the copper alloy structure of the resultant samplein this Comparative Example 43 was examined, it was impossible toexamine characteristics thereof. TABLE 6 Precipitate X Precipitate YCrystal Bending Bending Elements Grain Grain grain Tensile Electricalproperty property Ni Si size Density/ size Density/ size strengthconductivity GW BW mass % mass % μm mm² μm mm² μm MPa % IACS R/t R/tExample 43 3.9 0.8 0.023 5 × 10¹⁰ 0.250 2 × 10⁵ 9 821 35 1 1 Example 443.7 0.8 0.020 3 × 10¹⁰ 0.290 4 × 10⁵ 12 856 35 1 1 Example 45 4.3 1.10.025 3 × 10¹¹ 0.210 9 × 10⁵ 11 921 32 1.5 1.5 Example 46 2.3 0.6 0.0294 × 10⁸  0.300 5 × 10⁵ 9 709 40 1 1 Comparative 1.8 0.5 0.024 7 × 10⁷ 0.300 3 × 10⁵ 11 600 46 1 1 example 32 Comparative 5.5 1.57 0.022 9 ×10¹¹ 0.220 6 × 10⁵ 9 Not measurable due to working cracks example 33Comparative 2.1 0.25 0.028 4 × 10⁷  0.250 5 × 10⁵ 13 640 38 1 1 example34 Comparative 5.1 1.9 0.029 8 × 10¹¹ 0.330 7 × 10⁵ 18 Not measurabledue to working cracks example 35 Comparative 3.5 0.9 0.0005 6 × 10¹⁰0.380 8 × 10⁵ 14 779 32 1 1 example 36 Comparative 3.5 0.9 0.122 6 ×10¹⁰ 0.240 6 × 10⁵ 11 746 38 1 1 example 37 Comparative 3.1 0.8 0.028 7× 10⁶  0.320 5 × 10⁵ 13 756 31 1 1 example 38 Comparative 4.9 1.5 0.0305 × 10¹³ 0.300 5 × 10⁵ 12 Not measurable due to working cracks example39 Comparative 3.8 0.9 0.032 6 × 10¹⁰ 0.007 8 × 10⁵ 45 833 37 3 4example 40 Comparative 3.5 0.7 0.034 7 × 10¹⁰ 1.330 3 × 10⁵ 54 850 35 33 example 41 Comparative 3.7 0.8 0.032 4 × 10¹⁰ 0.300 8 × 10³ 32 832 342 2 example 42 Comparative 3.4 0.8 0.035 4 × 10¹⁰ 0.200 9 × 10⁹ 5 Notmeasurable due to working cracks example 43

Example 7

With respect to each of the following Examples according to the presentinvention, the copper alloys each containing Ni 4.0 mass %, Si 1.0 mass%, and the elements as shown in Table 7, with the balance being Cu andunavoidable impurities, were tested and evaluated in the same manner asin Example 5. The production method and the measurement method were thesame as those in Example 5. The copper alloy of Comparative Example 44had Ni 3.1 mass % and Si 0.7 mass %, the copper alloy of ComparativeExample 45 had Ni 3.9 mass % and Si 0.9 mass %, and the copper alloy ofComparative Example 46 had Ni 4.9 mass % and Si 1.2 mass %, each withthe balance being Cu and unavoidable impurities.

As is apparent from the results shown in Table 7, the copper alloys ofExamples according to the present invention each had excellentcharacteristics. However, contrary to the above, the copper alloys ofComparative Examples 44, 45, and 46 each did not contain any precipitateY, and thus each had a conspicuously large crystal grain size, and werepoor in bending property. TABLE 7 Added Precipitate X Precipitate YCrystal Bending Bending components Grain Grain grain Tensile Electricalproperty property Element: size Density/ size Density/ size strengthconductivity GW BW amount mass % μm mm² μm mm² μm MPa % IACS R/t R/tExample 47 Al 0.1, As 0.05 0.025 5 × 10¹⁰ 0.103 3 × 10⁶ 12 813 29 1.51.5 Example 48 Al 0.08, Hf 0.09 0.024 4 × 10¹⁰ 0.400 2 × 10⁷ 11 814 281.5 1.5 Example 49 Al 0.07, Zr 0.1 0.024 4 × 10¹⁰ 0.200 4 × 10⁶ 18 84331 1.5 1.5 Example 50 Cr 0.03 0.023 6 × 10¹⁰ 0.340 4 × 10⁶ 15 812 33 1.51.5 Example 51 Ti 0.1, C 0.03 0.014 5 × 10¹¹ 0.980 2 × 10⁴ 18 836 39 1.51.5 Example 52 Ti 0.06, C 0.02 0.024 4 × 10¹⁰ 0.760 1 × 10⁴ 13 834 381.5 1.5 Example 53 Zr 0.2 0.027 5 × 10¹⁰ 0.340 3 × 10⁶ 18 832 34 1.5 1.5Example 54 Cr 0.3 0.026 6 × 10¹⁰ 0.550 3 × 10⁶ 14 824 35 1.5 1.5 Example55 Fe 0.1, P 0.05 0.028 3 × 10¹⁰ 0.220 3 × 10⁶ 10 856 35 1.5 1.5 Example56 Fe 0.2, P 0.05 0.018 7 × 10¹⁰ 0.120 3 × 10⁷ 9 812 39 1.5 1.5 Example57 Fe 0.1, Zr 0.1 0.025 7 × 10¹⁰ 0.450 7 × 10⁵ 8 822 35 1.5 1.5 Example58 In 0.02 0.025 4 × 10¹⁰ 0.660 4 × 10⁵ 12 834 38 1.5 1.5 Example 59 Mg0.1, Sb 0.04 0.026 8 × 10⁹  0.430 2 × 10⁶ 15 814 28 1.5 1.5 Example 60Mn 0.2 0.018 6 × 10¹⁰ 0.400 7 × 10⁵ 11 808 31 1.5 1.5 Example 61 Sb 0.050.019 6 × 10¹⁰ 0.240 3 × 10⁵ 10 806 33 1.5 1.5 Example 62 Ta 0.1 0.027 3× 10¹⁰ 0.430 2 × 10⁶ 8 842 37 1.5 1.5 Example 63 V 0.08, Zr 0.08 0.026 3× 10¹⁰ 0.840 9 × 10⁵ 13 813 36 1.5 1.5 Comparative — 0.022 8 × 10⁹  NoneNone 29 803 39 2 2 example 44 Comparative — 0.025 4 × 10¹⁰ None None 30823 36 3 3 example 45 Comparative — 0.029 8 × 10⁹  None None 33 890 32 43 example 46Note;“—” not added

Example 8

The copper alloys each containing Ni, Si, Sn, Zn, Mg, and the elementsas shown in Table 8, with the balance being Cu and unavoidableimpurities, were tested and evaluated in the same manner as in Example5. The production method and the measurement method were the same asthose in Example 5.

As is apparent from the results shown in Table 7, the copper alloys ofExamples according to the present invention each had excellentcharacteristics. However, contrary to the above, the copper alloys ofComparative Examples 47, 48, 49, and 50 each did not contain anyprecipitate Y, and thus each had a conspicuously large crystal grainsize, and were poor in bending property. TABLE 8 Precipitate XPrecipitate Y Crystal Bending Bending Grain Grain grain TensileElectrical property property Elements (mass %) size Density/ sizeDensity/ size strength conductivity GW BW Ni Si Sn Zn Mg Other μm mm² μmmm² μm MPa % IACS R/t R/t Example 64 3 0.8 0.1 0.5 0.1 Sb 0.08 0.025 2 ×10¹⁰ 0.200 2 × 10⁶ 12 811 37 0.75 0.5 Example 65 3.5 0.9 0.024 6 × 10¹⁰0.325 3 × 10⁶ 11 842 35 0.75 0.75 Example 66 4 1.1 0.024 4 × 10¹⁰ 0.2503 × 10⁶ 18 865 33 1 1 Example 67 4.5 1.3 0.023 9 × 10¹⁰ 0.230 4 × 10⁶ 15891 31 1.5 1.5 Example 68 3 0.8 0.1 0.5 0.1 Cr 0.04 0.026 2 × 10¹⁰ 0.1504 × 10⁵ 12 805 36 0.75 0.5 Example 69 3.5 0.9 0.014 6 × 10¹⁰ 0.230 3 ×10⁵ 18 839 34 0.75 0.75 Example 70 4 1.1 0.024 9 × 10¹⁰ 0.190 4 × 10⁵ 13855 32 1 1 Example 71 4.5 1.3 0.027 1 × 10¹¹ 0.340 4 × 10⁵ 18 888 30 1.51.5 Example 72 3 0.8 0.1 0.5 0.1 Zr 0.2 0.026 4 × 10¹⁰ 0.150 9 × 10⁶ 14810 38 0.75 0.5 Example 73 3.5 0.9 0.028 7 × 10¹⁰ 0.280 8 × 10⁶ 10 83636 0.75 0.75 Example 74 4 1.1 0.018 9 × 10¹⁰ 0.190 1 × 10⁷ 9 856 33 1 1Example 75 4.5 1.3 0.025 2 × 10¹¹ 0.120 7 × 10⁶ 8 891 32 1.5 1.5Comparative 3 0.8 0.1 0.5 0.1 — 0.022 2 × 10¹⁰ None None 29 805 37 2 1.5example 47 Comparative 3.5 0.9 — 0.025 5 × 10¹⁰ None None 30 835 35 2 3example 48 Comparative 4 1.1 — 0.023 8 × 10¹⁰ None None 39 866 33 3 3example 49 Comparative 4.5 1.3 — 0.029 2 × 10¹¹ None None 33 880 30 4 4example 50Note:“—” not added

INDUSTRIAL APPLICABILITY

The copper alloy of the present invention can be preferably applied tolead frame, connector, or terminal materials for electric and electronicmachinery and tools, e.g. automobile connector/terminal materials,relays, and switches.

Having described our invention as related to the present embodiments, itis our intention that the invention not be limited by any of the detailsof the description, unless otherwise specified, but rather be construedbroadly within its spirit and scope as set out in the accompanyingclaims.

1. A copper alloy, comprising: a precipitate X composed of Ni and Si;and a precipitate Y that comprises Ni or Si or neither Ni nor Si,wherein the precipitate X has a grain size of 0.001 to 0.1 μm, and theprecipitate Y has a grain size of 0.01 to 1 μm.
 2. The copper alloyaccording to claim 1, wherein the precipitate Y has a melting pointhigher than a solution treatment temperature.
 3. The copper alloyaccording to claim 2, which comprises Ni 2 to 5 mass %, Si 0.3 to 1.5mass %, and B 0.005 to 0.1 mass %, with the balance being Cu andunavoidable impurities, wherein the number of grains of the precipitateX per mm² is 20 to 2,000 times the number of grains of the precipitate Yper mm².
 4. The copper alloy according to claim 3, wherein the number ofgrains of the precipitate X is 10⁸ to 10¹² per mm², and the number ofgrains of the precipitate Y is 10⁴ to 10⁸ per mm².
 5. The copper alloyaccording to claim 4, which comprises at least one element selected fromthe group consisting of Al, As, Hf, Zr, Cr, Ti, C, Fe, P, In, Sb, Mn,Ta, and V in an amount of 0.005 to 0.5 mass %.
 6. The copper alloyaccording to claim 5, wherein the precipitate Y is composed of at leastone of Al—As, Al—Hf, Al—Zr, Al—Cr, Ti—C, Cu—Ti, Cu—Zr, Cr—Si, Fe—P,Fe—Si, Fe—Zr, In—Ni, Mg—Sb, Mn—Si, Ni—Sb, Si—Ta, and V—Zr.
 7. The copperalloy according to claim 6, which further comprises at least one elementselected from the group consisting of Sn 0.1 to 1.0 mass %, Zn 0.1 to1.0 mass %, and Mg 0.05 to 0.5 mass %.
 8. The copper alloy according toclaim 7, which is for use in an electric or electronic machinery andtool.
 9. The copper alloy according to claim 2, which comprises Ni 2 to5 mass %, Si 0.3 to 1.5 mass %, Mn 0.01 to 0.5 mass %, and P 0.01 to 0.5mass %, with the balance being Cu and unavoidable impurities, whereinthe number of grains of the precipitate X per mm² is 20 to 2,000 timesthe number of grains of the precipitate Y per mm².
 10. The copper alloyaccording to claim 9, wherein the number of grains of the precipitate Xis 10⁸ to 10¹² per mm², and the number of grains of the precipitate Y is10⁴ to 10⁸ per mm².
 11. The copper alloy according to claim 10, whichcomprises at least one element selected from the group consisting of Al,As, Hf, Zr, Cr, Ti, C, Fe, P, In, Sb, Mn, Ta, and V in an amount of0.005 to 0.5 mass %.
 12. The copper alloy according to claim 11, whereinthe precipitate Y is composed of at least one of Al—As, Al—Hf, Al—Zr,Al—Cr, Ti—C, Cu—Ti, Cu—Zr, Cr—Si, Fe—P, Fe—Si, Fe—Zr, In—Ni, Mg—Sb,Mn—Si, Ni—Sb, Si—Ta, and V—Zr.
 13. The copper alloy according to claim12, which further comprises at least one element selected from the groupconsisting of Sn 0.1 to 1.0 mass %, Zn 0.1 to 1.0 mass %, and Mg 0.05 to0.5 mass %.
 14. The copper alloy according to claim 13, which is for usein an electric or electronic machinery and tool.
 15. The copper alloyaccording to claim 2, which comprises Ni 2 to 5 mass %, Si 0.3 to 1.5mass %, B 0.005 to 0.1 mass %, Mn 0.01 to 0.5 mass %, and P 0.01 to 0.5mass %, with the balance being Cu and unavoidable impurities, whereinthe number of grains of the precipitate X per mm² is 20 to 2,000 timesthe number of grains of the precipitate Y per mm².
 16. The copper alloyaccording to claim 15, wherein the number of grains of the precipitate Xis 10⁸ to 10¹² per mm², and the number of grains of the precipitate Y is10⁴ to 10⁸ per mm².
 17. The copper alloy according to claim 16, whichcomprises at least one element selected from the group consisting of Al,As, Hf, Zr, Cr, Ti, C, Fe, P, In, Sb, Mn, Ta, and V in an amount of0.005 to 0.5 mass %.
 18. The copper alloy according to claim 17, whereinthe precipitate Y is composed of at least one of Al—As, Al—Hf, Al—Zr,Al—Cr, Ti—C, Cu—Ti, Cu—Zr, Cr—Si, Fe—P, Fe—Si, Fe—Zr, In—Ni, Mg—Sb,Mn—Si, Ni—Sb, Si—Ta, and V—Zr.
 19. The copper alloy according to claim18, which is for use in an electric or electronic machinery and tool.